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High-Transmittance TGV Sapphire Substrate Conductive Aerospace Automotive AR VR

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High-Transmittance TGV Sapphire Substrate Conductive Aerospace Automotive AR VR

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Brand Name :ZMSH
Place of Origin :China
MOQ :1
Payment Terms :T/T
Material :Single-crystal Sapphire (C-plane, A-plane optional)
Thickness :100 μm – 1000 μm
Via Diameter :≥ 20 μm
Aspect Ratio :≥ 10:1
Surface Roughness :Ra < 1 nm (polishing available)
Package Compatibility :Fan-out, Flip-chip, MEMS packaging, etc.
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Product Overview

TGV Sapphire​​ is a transparent conductive glass material based on sapphire (Al₂O₃) substrates, coated with transparent conductive oxide (TCO) films (e.g., ITO, AZO) via magnetron sputtering. TGV Sapphire combines sapphire’s ultra-high hardness, high-temperature resistance, and TCO films’ conductivity and transparency, making it ideal for high-performance electronic devices in extreme environments.

Principle

Using laser drilling or dry etching, vertical vias with high aspect ratios are created in the sapphire substrate. These vias are metallized to enable vertical electrical signal transmission, while maintaining the sapphire’s optical clarity and mechanical integrity.

Sapphire Substrate​​: Sapphire (Al₂O₃) is one of the hardest oxide materials in nature, offering exceptional chemical stability, high thermal conductivity (~40 W/m·K), and a wide optical bandgap (~9.9 eV), enabling resistance to high temperatures and harsh chemical environments.


​​Transparent Conductive Layer​​: A nano-scale TCO film (e.g., ITO) is deposited on the sapphire surface via physical vapor deposition (PVD), balancing high transmittance (>90%) and low sheet resistance (≤10 Ω/sq).

Technical Challenges

Extreme Hardness
Sapphire has a Mohs hardness of 9 (second only to diamond), making traditional mechanical drilling tools (e.g., tungsten carbide drills) prone to rapid wear or even ineffective.

Brittle Fracture Risk
Sapphire’s single-crystal structure makes it susceptible to micro-cracks, edge chipping, or delamination during machining, compromising hole-wall quality and device reliability.

Micro-Hole Requirements
For LED chips or MEMS sensors, holes with diameters <100 μm are often needed, requiring precision within ±1 μm.

Thermal Damage Control
High-temperature processes (e.g., laser drilling) may cause localized melting or thermal stress cracks.

Specification

Item Typical Values (Customizable)
Material Single-crystal Sapphire (C-plane, A-plane optional)
Thickness 100 μm – 1000 μm
Via Diameter ≥ 20 μm
Aspect Ratio ≥ 10:1
Via Density > 1,000,000 vias/cm² (optional)
Metallization Ti/Cu, Ni/Au, Pt, etc.
Surface Roughness Ra < 1 nm (polishing available)
Package Compatibility Fan-out, Flip-chip, MEMS packaging, etc.

Applications​

Consumer Electronics​​: Scratch-resistant AR/VR displays, flexible OLED backplanes.

High-Transmittance TGV Sapphire Substrate Conductive Aerospace Automotive AR VR
​​Optoelectronics​​: Laser window components, UV sensors, high-power LED substrates.

High-Transmittance TGV Sapphire Substrate Conductive Aerospace Automotive AR VR
​​Automotive​​: Automotive displays, LiDAR optical components.

High-Transmittance TGV Sapphire Substrate Conductive Aerospace Automotive AR VR
​​Aerospace​​: Radiation-resistant satellite parts and spacecraft windows.

High-Transmittance TGV Sapphire Substrate Conductive Aerospace Automotive AR VR

Q&A

Q1​​: What’s the difference between TGV Sapphire and ordinary conductive glass?
​​A1​​: TGV Sapphire is 10x harder than regular glass, withstands temperatures up to 600℃, and operates in harsh chemical environments.

​​Q2​​: Can TGV Sapphire be customized (e.g., shape cutting, thickness adjustment)?
​​A2​​: Yes, customizable dimensions, thickness (0.5mm~5mm), and conductive layer patterns are available.

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​​Q3​​: Does extreme temperature affect TGV Sapphire conductivity?
​​A3​​: Sapphire’s CTE matches silicon chips, ensuring stable conductivity under high temperatures.

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