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The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics, glass, and composites. Engineered with dual-spindle technology, multi-axis control, and fully automated systems, this machine delivers unmatched accuracy and efficiency for applications like wafer dicing, FPC flexible board cutting, and micro-component processing.
Key Applications:
Core Advantages:
Technical Specifications
Parameter | Value |
---|---|
Working Size | Φ8″, Φ12″ |
Main Spindle | Dual Power: 1.2/1.8/2.4/3.0 kW; Max Speed: 60,000 RPM |
Tool Size | 2″–3″ |
Y1/Y2 Axis | Repeatability: ±0.0001 mm; Travel Range: <0.002 mm; Speed: 310 mm/s |
X Axis | Speed: 0–600 mm/s; Repeatability: ±0.001 mm |
Z1/Z2 Axis | Repeatability: ±0.002 mm; Travel Range: 0–600 mm/s |
O Axis | Rotation Angle: ±15°; Repeatability: ±0.001 mm |
Cleaning Table | Speed: 100–300 RPM; Fully Automatic Washing System |
Working Voltage | 3-Phase 380V, 50 Hz |
Dimensions (L×W×H) | 1550 × 1255 × 1880 mm |
Weight | 2100 kg |
Performance & Quality of Dicing Machine
Precision Engineering
Speed & Efficiency
Durability
Application
ZMSH Automated Precision Dicing Machine
Frequently Asked Questions (FAQ)
Q: What materials can this machine handle?
A: It’s designed for cutting brittle materials like semiconductors, ceramics, glass, and composites. Common uses include slicing wafers, processing flexible printed circuits (FPC), and precision components for electronics or medical devices.
Q: How precise is the machine?
A: It achieves extremely fine cuts with accuracy down to 0.0001 mm (thinner than a human hair). This ensures clean edges with minimal chipping, even for delicate materials.
Q: What power does it need?
A: It runs on standard 3-phase 380V power (common in industrial settings). The dual-spindle system adapts to different materials by adjusting power output.