SHANGHAI FAMOUS TRADE CO.,LTD

SHANGHAI FAMOUS TRADE CO.,LTD

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Micro-jet laser machine for Metal matrix composite processing wafer cutting dicing slicing

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Micro-jet laser machine for Metal matrix composite processing wafer cutting dicing slicing

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Brand Name :ZMSH
Place of Origin :China
MOQ :1
Payment Terms :T/T
Delivery Time :6-8 month
Countertop volume :300*300*150
Linear axis XY :Linear motor. Linear motor
Linear axis Z :150
Positioning accuracy μm :+/-5
Repeated positioning accuracy μm :+/-2
Numerical control :3 axis /3+1 axis /3+2 axis
Numerical control type :DPSS Nd:YAG
Wavelength nm :532/1064
Rated power W :50/100/200
Water jet :40-100
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Micro-jet laser machine for Metal matrix composite processing wafer cutting dicing slicing

Micro-jet Laser Equipment & Linear Motor for Wafer Dicing and Slicing Product Overview:

The Micro-jet Laser Machine is a cutting-edge solution designed for high-precision processing of Metal Matrix Composites (MMCs), along with wafer cutting, dicing, and slicing. Utilizing advanced laser microjet (LMJ) technology, this machine provides a unique combination of laser energy and high-speed water jet for efficient and clean material removal, significantly reducing thermal damage and mechanical stress on sensitive materials. Ideal for industries such as semiconductor manufacturing, aerospace, and advanced materials processing, the system excels in handling hard and brittle materials like Silicon Carbide (SiC), Gallium Nitride (GaN), and other specialized composites. Its automated, low-waste operation ensures superior surface finishes, high-quality cuts, and reliable, consistent results, contributing to increased yield rates and reduced operational costs. This technology addresses traditional processing limitations, offering a sustainable and scalable solution for the most demanding applications in high-performance industries.


Machine Specifications:

Specification Model 1 Model 2
Countertop Volume 300 x 300 x 150 mm 400 x 400 x 200 mm
Linear Motor (XY Axis) Linear motor Linear motor
Linear Motor (Z Axis) 150 mm 200 mm
Positioning Accuracy ±5 μm ±5 μm
Repeated Positioning Accuracy ±2 μm ±2 μm
Acceleration 1 G 0.29 G
Numerical Control (CNC) 3 - axis / 3+1 axis / 3+2 axis 3 - axis / 3+1 axis / 3+2 axis
Laser Type DPSS Nd:YAG DPSS Nd:YAG
Wavelength 532 nm / 1064 nm 532 nm / 1064 nm
Rated Power 50 W / 100 W / 200 W 50 W / 100 W / 200 W
Water Jet 40 - 100 40 - 100
Nozzle Pressure 50 - 100 bar 50 - 600 bar
Dimensions (Machine) 1445 x 1944 x 2260 mm 1700 x 1500 x 2120 mm
Dimensions (Control Cabinet) 700 x 2500 x 1600 mm 700 x 2500 x 1600 mm
Weight (Machine) 2.5 tons 3 tons
Weight (Control Cabinet) 800 kg 800 kg

Processing Capabilities:

Capability Model 1 Model 2
Surface Roughness Ra ≤ 1.6 μm Ra ≤ 1.2 μm
Opening Speed ≥ 1.25 mm/s ≥ 1.25 mm/s
Circumference Cutting Speed ≥ 6 mm/s ≥ 6 mm/s
Linear Cutting Speed ≥ 50 mm/s ≥ 50 mm/s


Materials Processed:

  • Gallium Nitride (GaN) Crystal

  • Ultra-Wide Band Gap Semiconductors (Diamond / Gallium Oxide)

  • Aerospace Special Materials

  • LTCC Carbon Ceramic Substrates

  • Photovoltaics

  • Scintillator Crystals


Our Advantages

  1. Cutting-Edge Micro-jet Laser Technology
    We are at the forefront of utilizing Laser Microjet (LMJ) technology, which combines laser energy with high-speed water jets to achieve precise and efficient material removal. This innovative approach results in minimal thermal damage and ensures superior quality cuts for hard and brittle materials like Silicon Carbide (SiC), Gallium Nitride (GaN), and other advanced semiconductors.

  2. High Efficiency and Precision
    Our micro-jet laser equipment offers remarkable processing efficiency, significantly enhancing throughput while maintaining high precision. This capability is especially crucial in industries such as semiconductor manufacturing and aerospace, where precision is essential for maintaining the structural integrity of materials.


Q&A for Micro-jet Laser Machine

Q1: What is the Micro-jet Laser Machine and how does it work?
A1:
The Micro-jet Laser Machine combines advanced Laser Microjet (LMJ) technology, which integrates a focused laser beam with a high-speed water jet. This combination allows for precise, efficient, and clean material removal. The water jet stabilizes the laser, reducing thermal damage and mechanical stress while ensuring high-precision cuts in hard and brittle materials.

Q2: What materials can the Micro-jet Laser Machine process?
A2:
The Micro-jet Laser Machine is highly versatile and can process a wide range of materials, including:

  • Silicon Carbide (SiC)

  • Gallium Nitride (GaN)

  • Ultra-Wide Bandgap Semiconductors (Diamond, Gallium Oxide)

  • Aerospace Special Materials

  • LTCC Carbon Ceramic Substrates

  • Photovoltaic Components

  • Scintillator Crystals

It is suitable for industries such as semiconductor manufacturing, aerospace, and advanced materials processing.

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